high speed features designed for mounting on small surface. extremely thin/leadless package. low leakage current. high mounting capability, strong surge withstand, high reliability. mechanical data case: 1005 (2512) standard package, molded plastic. t erminals: gold plated, solderable per mil-std-750, method 2026. polarity: indicated by cathode band. mounting position: any . weight: 0.006 gram (approximately) smd switching diode smd switching diode parameter repetitive peak reverse voltage reverse voltageaverage forward current forward current , surge peak repetitive peak forward current power dissipationstorage temperature junction temperature conditions symbol v rrm v r i o i fsm i frm p d t stg t j min -40 -40 max 90 80 100 225 300 +125 +125 typ 1000 unit v v ma ma ma mw maximum rating ( at t a = 25 c unless otherwise noted ) c c preliminary electrical characteristics ( at t a = 25 c unless otherwise noted ) unit v ua pf ns parameter forward voltage reverse currentcapacitance between terminals reverse recovery time conditions i f = 100 ma dc v r = 80 v f = 1mhz, and 0.5vdc reverse voltage v r = 6v, i f = 10 ma, r l =50 ohms symbol v f i r c t trr min typ 3 4 max 1.0 0.1 8.3 ms single half sine-wave superimposed on rate load ( jedec method ) s m d d io d e s s p e c ia li s t comchip page 1 rev:a qw-a8003 CDSF355-B01 (lead-free device) 0.1 02( 2.6 0) 0.0 95( 2.4 0) 0.0 20( 0.5 0) ty p. 0.0 51( 1.3 0) 0.0 43( 1.1 0) 0.0 35( 0.9 0) 0.0 27( 0.7 0) dim en sio ns in in ch es an d ( mi llim ete r) 10 05 (2 51 2) 0.0 12 ( 0.3 0) ty p. 0.0 20( 0.5 0) ty p.
smd switching diode smd switching diode reverse voltage (v) r e v e r s e c u r r e n t ( a ) 0.2 0.4 0.8 0 1.0 0.6 10 0n 10 0p 10 00 m 10 m 1 00 m 1u 10 n 1n 1.2 1m 10 0u 10 u 0 10 20 30 40 50 60 70 80 reverse voltage : (v) c a p a c i t a n c e b e t w e e n t e r m i n a l s : ( p f ) 0 5 10 15 20 25 30 0 1.0 2.0 3.0 4.0 5.0 f=1mhz ta = 25 c ambient temperature ( c) forward voltage (v) a v e r a g e f o r w a r d c u r r e n t ( % ) f o r w a r d c u r r e n t ( a ) 10 u 7 5 c 1 2 5 c - 2 5 c 2 5 c 75 c 125 c 25 c 0 20 40 60 80 10 0 0 25 50 75 100 125 150 mounting on glass epoxy pcbs fig. 1 - forw ard cha racte ristic s fig. 2 - rev erse ch aract eristi cs fig. 4 - curre nt d erating curve fig. 3 - cap acita nce bet ween te rmina ls chara cteris tics s m d d io d e s s p e c ia li s t comchip page 2 rev:a qw-a8003 rating and characteristic curves (CDSF355-B01)
|
